NASA's Langley Research Center engineering facility has published a technical bulletin addressing rare cases of cracking in chip resistor housings used in agency projects. Chip resistors are widely used in NASA's electronic printed circuit board assemblies; however, damage to their ceramic (aluminum oxide) substrates during environmental testing is extremely rare. The document describes two documented cases of thick-film chip resistor cracking. Damage occurred during thermal cycling conducted after vibration testing of the components. A distinctive feature was that cracks formed across the short axis of the resistor housing. NASA specialists studied the causes and mechanisms of defect formation to develop recommendations for preventing such damage in future projects using chip resistors as part of printed circuit boards. The complete technical report is available for download in PDF format on the agency's website. For additional information on this matter, you can contact Joel W. Sills from NASA's Langley Research Center at the provided email address.